Abstract

Micro-fabricated vibration energy harvesters enable merits such as miniaturisation, economies of scale for manufacturing, and ease of integration with semiconductor IC technologies. However, the frequency range of ambient vibration is generally low (10’s Hz to 100’s Hz). Existing MEMS vibration energy harvesters that target these frequencies typically are in the centimetre scale range. This sacrifices the miniaturisation aspect as well as introducing new challenges in packaging and integration for the unconventionally large MEMS devices. This paper proposes a new interdigitated fork cantilever array topology, which allows for up to about a third reduction in resonant frequency compared to the classical cantilever topology, for the same design area and without compromising on power optimisation. Further resonant frequency reduction is also possible, but at the expense of power optimisation. This opens up design flexibility to achieve low frequency MEMS resonators that are more suitable to practically target ambient vibration, without sacrificing the aforementioned merits of MEMS technology.

Highlights

  • Vibration energy harvesting (VEH) holds the promise to realise a self-sustaining on-board power source for autonomous sensors and microelectronics

  • Micro-cantilever topology has been widely employed for MEMS VEH due to its good power responsiveness, ease of design, minimal fabrication process complexity, and relatively low frequency [1, 2]

  • To address the current undesirable volumetric sacrifice to accommodate low frequency devices, this paper presents a new interdigitated fork topology for micro-cantilever arrays

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Summary

Introduction

Vibration energy harvesting (VEH) holds the promise to realise a self-sustaining on-board power source for autonomous sensors and microelectronics. MEMS fabrication technology brings several benefits to miniaturisation, ease of integration with IC and economies of scale for manufacturing. Micro-cantilever topology has been widely employed for MEMS VEH due to its good power responsiveness, ease of design, minimal fabrication process complexity, and relatively low frequency [1, 2]. The dominant active frequency of ambient vibration for most applications typically range from 10’s Hz to 100’s Hz [3], which presents a key design challenge for MEMS resonators. The implemented micro-cantilevers tend to measure greater than several centimetres in dimension, which result in atypical out-of-plane travel for the MEMS oscillators that can attain ∼1 mm in peak displacement [4]. The unconventionally large size of the required VEH device erodes the traditional scaling and integration benefits of MEMS technologies. Large dies with substantial vertical travel introduces a non-trivial and expensive packaging challenge

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