Abstract

The Si–Ge interdiffusivity in epitaxial strained Si/Si1−yGey/strained Si/relaxed Si1−x0Gex0 and strained Si/relaxed Si1−x0Gex0 heterostructures is investigated for Ge fractions between 0 and 0.56 over the temperature range of 770–920 °C. Si–Ge interdiffusivity is found to increase by 2.2× for every 10% increase in local Ge fraction for interdiffusion in strained Si/relaxed SiGe structures. Significantly enhanced Si–Ge interdiffusion is observed in structures with Si1−yGey layers under biaxial compressive strain. The interdiffusivity increases by 4.4× for every 0.42% increase in the magnitude of biaxial compressive strain. These results were incorporated into an interdiffusion model that successfully predicts the interdiffusion in epitaxial SiGe heterostructures.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call