Interconnects for Elastically Stretchable and Deformable Electronic Surfaces

Abstract

AbstractDeformable, large-area electronic surfaces are desirable for many human-machine interfaces. The goal of our research is to fabricate elastically deformable electronics by integrating electronic devices and stretchable interconnects onto a flexible substrate. The focus of this paper is the fabrication and electrical performance of the stretchable interconnects. Au was deposited onto a silicone elastomer (PDMS) and patterned to achieve a resolution of 2 μm. Two patterning techniques are presented: patterning by shadow mask and patterning by photolithography. Photolithographic patterning on PDMS is not straightforward. First, we discuss the challenges in patterning and then the morphology of lines patterned by both techniques. The electrical resistance of the Au lines under tensile strain is presented. Interconnects patterned by shadow mask remain electrically conductive up to 100 % strain. Those patterned by photolithography maintain electrical conductivity when strained up to 60 %.