Interconnection of Multi-Pad Electrodes by "Controlled Anisotropic Extraneous (CAEx) Deposition" of Electroless NiB Film

Abstract

Interconnection of multi-pad array was developed by using the electroless CAEx deposition of NiB for application to the new flip-chip bonding technology. Behavior of CAEx deposition of Electroless NiB films was depended on pad width and distance between facing pads, and pad with nearer distance and wider pad size was achieved. Practical feasibility of this technique was demonstrated by forming interconnection between pads separated by 5 micrometer and measuring 5 micrometer in both height and width. This method was applied successfully to interconnecting the pads forming an array with a pitch of 20 micrometer.