Abstract
High density assembly of PCB(Printed Circuit Board) is essential to small-size electronic devices. This paper reports on the interconnection of insulated fine wires of 20-100 micrometer diameters. Three new techniques are discussed: first, the thermal decomposition of high polymer is evaluated quantitatively; second, conditions for solid-state bonding of copper is studied using recrystallization growth rate equation and temperature simulation by FEM; lastly the current control unit for micro resistance bonding is developed. An interconnection machine has been developed, which decomposes high polymer insulation of wires by a CO 2 laser and bond them without thermal damage of PCB.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
