Abstract
Examples of interconnection failures in circuit assemblies are reviewed. These interconnection failures are examples of corrosion and fraction of the metal circuit conductors. Failure mechanisms are described and modifications in design, process, or materials to eliminate the failure are provided, for each case study. In general, the failures examined are microscopic manifestations of familiar macroscopic corrosion and fraction mechanisms. The case studies of corrosion and fracture are described separately. >
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