Interconnect for Dense Electronically Scanned Antenna Array Using High-Speed Vertical Connector.

Abstract

We present the design and the performance evaluation of a new interconnect for large-scale densely packed electronically scanned antenna arrays that utilize a high-speed digital board-to-board vertical connector. The application targets microwave tissue, imaging in the frequency range from 3 GHz to 8 GHz. The tissue-imaging arrays consist of hundreds of active antenna elements, which require low-reflection, low-loss, and low-crosstalk connections to their respective receiving and transmitting circuits. The small antenna size and the high array density preclude the use of coaxial connectors, which are also expensive and mechanically unreliable. Modern board-to-board high-speed connectors promise bandwidths as high as 12 GHz, along with high pin density, mechanical robustness, and low cost. However, their compatibility with the various transmission lines leading to/from the miniature printed antenna elements and microwave circuitry is not well studied. Here, we focus on the design of the transitions from coplanar waveguide transmission lines to/from a high-speed vertical connector. The performance of the interconnect is examined through electromagnetic simulations and measurements. Comparison is carried out with the expensive sub-miniature push-on sub-micro coaxial connectors commonly used in miniature radio-frequency electronics. The results demonstrate that high-speed vertical connectors can provide comparable performance in the UWB frequency range.