Interconnect and Packaging Techniques for System Integration of High Power Assemblies that Improve Assembly Efficiency and Design Flexibility

Abstract

Growth in electrification and power conversion is driving a large need for electrical efficiency and improved cost models that in theory can be gained through the design consolidation of secondary assemblies into complete single modules. To put this theory into practice, there must be a cost effective way to interconnect these subassemblies that is space efficient, easy to assemble, supports high power and is resilient to temperature cycles. To integrate subassemblies cost effectively is to develop them so that they have interconnects between each subassembly that are an integral part of the subassembly itself and are not secondary add on or bolt on connector systems. Additionally these interconnects must be easily pluggable, to allow assembly methods that are manufacturing friendly, measureable and don't require secondary heating methods. This paper will show how proven highly reliable interconnects like press-fit, IDC and wirebonds can be integrated into subassemblies along with capacitors, motors, DBC power substrates, thermal coolers, heats sinks, busbars and other subassemblies typically found in power assemblies, to create a cost effective design that provides flexibility in manufacturing assembly with measureable results.