Abstract
AbstractDisorder‐induced electronic localization is responsible for the OFF state of the Ovonic threshold switching (OTS) device, which is an indispensable component in the present 3D‐crossbar‐architecture phase‐change memory circuit. However, the atomic mechanism of the OTS device, especially the role of thermal effect, remains a long‐term open question. Recent researches suggest that the working current of the OTS ON‐state is often large enough to melt the adjacent phase‐change memory material in the OTS+PCM devices. Thus, Joule heating‐induced atomic/electronic structure transition in OTS materials must be seriously considered. Taking the typical OTS material GeSe as an example, first‐principles calculations reveal an unexpected electronic delocalization induced by the enhanced structural disorder upon solid‐liquid transition. Meanwhile, as the temperature rises, the band gap decreases or even closes, leading to an increase in carrier concentration. Therefore, the melting filament with high conductivity could be responsible for the holding‐ON state of OTS materials. The results in this study may provide possible explanations for some puzzles of OTS devices, such as the reasons for holding‐ON state and limited endurance.
Published Version
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