Abstract

Abstract This paper documents ongoing research into using Artificial Intelligence (AI) techniques to intelligently control finite element thermal analyses. These techniques are used to implement component level decomposition of the physical domain and to integrate domain information into the analysis process. Techniques developed by this research have been implemented into a new finite element program. This program uses a blackboard architecture to integrate the various numerical and symbolic knowledge sources. The blackboard architecture also supports the storage of all data in an object oriented form. A test problem involving transient thermal analysis of an integrated circuit package show significant decrease in the number of floating point operations when using this method.

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