Abstract
The article deals with the organization of tests for electronic devices, designed to work in difficult operating conditions, such as conditions on the board of a spacecraft. The intelligent measurement system for monitoring the technical state condition of chips through measurement of surface temperature field is presented. A method for decision making based on comparative analysis of measured thermograms and thermal images obtained on computational models for various chip failures is considered. An application of an integrated Raman-infrared thermography to measure the internal chip temperature areas is proposed.
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