Abstract

Intelligent compaction (IC) is an innovative and modified technology used for quality control in subgrade digital construction. However, current intelligent compaction measurement values (ICMVs) cannot provide accurate measurement of the filling layer when the strength of the underlying layer is relatively high. Experimental field tests conducted in the cut to fill subgrade were performed to collect and analyze the variability of ICMV called the vibration modulus (Evib). Furthermore, a new ICMV called the modulus of vibration compaction (Evc) that could remove the interference of the underlying layer and reveal the actual compaction state of filling layer is presented based on the theoretical analysis and numerical simulation method. It was also extracted to study the variability of the filling layer’s compaction state. The results of the above research indicate the influence of the underlying layer’s stiffness on overall compaction quality is remarkable. It was found that it is more likely to achieve the variability control of the compaction state of the filling layer by a new ICMV called Evc. The measured data, improved approaches, and associated conclusions that are presented provide valuable information for researchers and employees considering the use of IC technology.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.