Integration of silicon MEMS devices: Materials and processing considerations

Abstract

Abstract When developing new MEMS devices, there are a number of decisions which have to be made. The first of these is which technology to use. Today, there are a range of silicon-based micromachining technologies available. In addition to wet bulk micromachining and surface micromachining, new processes available include epi-micromachining and deep plasma etching. The second question is often more difficult, and that is whether or not to integrate. The integration of sensors with electronics can present a number of advantages, in particular when dealing with small signals or noisy environments. However, there are a number of issues to be considered in terms of materials and processing compatibility.