Abstract
The eligibility of poly(vinylidene fluoride–trifluoroethylene) films for microsystemintegration has been investigated with respect to strongly strain-reliant device designs suchas for example vibration-based piezoelectric energy harvesting devices. Due to their abilityto withstand extraordinary elongations, the integration of polymeric materials intoappropriately designed devices is exceptionally promising and has been accordinglyassessed. However, polymeric films often suffer from an immense sensitivity to many of theprocessing steps used during microfabrication like lithography. This contribution will showthat this is not necessarily so. Functional films have been prepared and comprehensivelycharacterized providing a benchmark for processing induced material deterioration.Further, the damage potential emanating from consecutive processing and lithographicalpattern transfer steps was focused on. The inferred course of action was finallyapplied to the fabrication and vibrational proof of concept of a microsystem basedon the polymeric material system poly(vinylidene fluoride–trifluoroethylene).
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