Integrating the SOI and poly-Si surface structures in a monolithic process for optical devices platform

Abstract

This work has successfully integrated thick single-crystal silicon (SCS) and thin film poly-Si microstructures on a SOI wafer using monolithic processes. Thus high optical quality micromirror and large output microactuators are available using the thick SOl wafer. Moreover, the poly-Si thin film microstructures serve as micro-hinges and stress-induced self-assembly mechanisms. The microstructures will be lifted and assembled by Si/sub x/N/sub y//poly-Si bimorph beams after releasing. This integrated process can substantially increase the feasibility of fabricating MEMS devices using SCS.