Abstract
There is currently a lack of understanding of the deposition profile in a batch atomic layer deposition (ALD) process. Also, no on-line control scheme has been proposed to resolve the prevalent disturbances. Motivated by this, we develop a computational fluid dynamics (CFD) model and an integrated online run-to-run and feedback control scheme. Specifically, we analyze a furnace reactor for a SiO2 thin-film ALD with BTBAS and ozone as precursors. Initially, a high-fidelity 2D axisymmetric multiscale CFD model is developed using ANSYS Fluent for the gas-phase characterization and the surface thin-film deposition, based on a kinetic Monte-Carlo (kMC) model database. To deal with the disturbance during reactor operation, a proportional integral (PI) control scheme is adopted, which manipulates the inlet precursor concentration to drive the precursor partial pressure to the set-point, ensuring the complete substrate coverage. Additionally, the CFD model is utilized to investigate a wide range of operating conditions, and a regression model is developed to describe the relationship between the half-cycle time and the feed flow rate. A run-to-run (R2R) control scheme using an exponentially weighted moving average (EWMA) strategy is developed to regulate the half-cycle time for the furnace ALD process between batches.
Highlights
Deposition is a vital part of thin-film manufacturing and vacuum deposition methods, and especially chemical vapor deposition (CVD) methods are crucial to the semiconductor manufacturing industry due to their superior capabilities depositing high quality and high-performance oxide and solid materials
The R2R and PI controllers are integrated with the multiscale computational fluid dynamics (CFD) model via a message-passing interface (MPI), and the closed-loop performance under a vacuum pump disturbance is evaluated
In the Si-cycle, the BTBAS precursor is introduced into the batch atomic layer deposition (ALD) reactor, which reacts with the substrate surface to form a Si layer, whereas in the O-cycle, the O layer is produced by ozone
Summary
Deposition is a vital part of thin-film manufacturing and vacuum deposition methods, and especially chemical vapor deposition (CVD) methods are crucial to the semiconductor manufacturing industry due to their superior capabilities depositing high quality and high-performance oxide and solid materials. In an experimental work and industrial pilot plant, the operating cost associated with the detailed tests in exploring the optimal operating conditions for the batch ALD systems, especially furnaces, is very high due to the large physical scale and the long processing time [9]. A 2D axisymmetric multiscale CFD model is first formulated, combining the surface deposition domain and the gas-phase transport domain, and is validated with respect to industrial and experimental results. The R2R and PI controllers are integrated with the multiscale CFD model via a message-passing interface (MPI), and the closed-loop performance under a vacuum pump disturbance is evaluated
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