Abstract
This paper examines the engineering challenges created by integrated surface micromachining, which is the combination of MEMS and electronics on the same silicon substrate. It then goes on to explore the future trends in this area from both the technical challenges as well as an applications and business perspective. The low level signals that are detectable and processed make dimensional changes in the nanometer range a common aspect of this technology. The mechanical engineer is faced with structures that have millimeter dimensions with deflections from 10 nanometers to subnanometer ranges. It is therefore possible to sense acceleration, magnetic forces, and acoustic energy as well as steer light in a fully intergrated system on a chip. The applications from a technical perspective seem endless however the need to develop both a process and a product make the time to market a significant consideration. The paper concludes by highlighting promising areas such as communications, displays, and sensing, for future development from both a technical and business perspective.
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