Integrated super-engineering polymeric electromagnetic interference shielding films withstanding the extreme environments

Abstract

The electromagnetic interference (EMI) poses a threat to electronic equipment and human health, which has spawned the development of polymer-based EMI shielding materials. However, it is challenging to combine their ease of fabrication with extreme environmental resistance. Herein, a simple and consecutive bottom-up assembly route is developed to prepare EMI shielding films based on a super-engineering polymer named polyarylene ether nitrile (PEN). Thanks to the morphological transformation of PEN films, the integration of polymeric matrix and commercial carbon nanotubes is throughout the vacuum-assisted deposition and hot-press molding, resulting in a series of sandwiched nanocomposite films. In the whole X-band, the EMI SE of the nanocomposite film is up to 30 dB with a low thickness of 0.268 mm. Besides, the absorption coefficient (A) can be significantly increased to 0.93, exhibiting an excellent adsorption-dominant shielding mechanism. Due to the super-engineering polymer as a matrix, the sandwiched nanocomposite films are endowed with excellent thermal stability (Td5 = 512 °C), superior tensile strength (69 MPa) as well as improved hydrophobicity (103°). Notably, the EMI shielding and mechanical performances manifest outstanding reliability under harsh environments, including strong acid, alkali, and high-temperature treatments. The integrated preparation towards super-engineered polymer-based nanocomposites is efficient and economical, affording EMI shielding films resisting multiple harsh environments.