Integrated RF module produced by aerosol deposition method

Abstract

Integrating and embedding various passive components like capacitors, and inductors, in one system module, is one of the attractive ways to achieve down-sizing, cost-reduction and higher performance in RF wireless communication products. Because the unique aerosol deposition (AD) method, we developed creates a dense ceramic film, that can be deposited at room temperature, and that possesses electric properties that are close to that of bulk ceramics, we can offer a module with passive components by incorporating different materials with various process temperatures. In this paper, we have presented our novel approach to RF modules compared with other processes and methods. We also examined the microstructure and dielectric properties of high Q ceramic dielectric film for microwave filter applications and high K ceramic dielectrics deposited by the AD method at RT. As a result, a 500 dielectric constant and a 450 Q value at 10GHz were clearly attained with our ceramic AD films deposited on FR4 substrates at RT. Decoupling capacitors embedded in epoxy-based substrates fabricated as prototypes using AD film indicated about 300nF/cm/sup 2/. By developing other various functional ceramic dielectric films with the AD method and increasing the dielectric properties of those films, we can expect to attain our target: a small RF integrated module incorporating a lot of functions.