Integrated on-site collection and off-site analysis of airborne molecular contamination in cleanrooms for integrated circuit manufacturing processes

Abstract

Both long-term on-site collection and off-site analysis methods were conducted to investigate airborne molecular contaminants (AMCs) in a semiconductor wafer cleanroom. The removal efficiency of SO2 and NO2 for chemical filters on a make-up air unit (MAU) in the cleanroom is approximately 50%, though this value does not meet the removal efficiency mentioned in the GB 36306 standard. The removal efficiencies of SO2, H2S, NO, NO2, NH3, and TVOC were approximately 76.5%, 50.9%, 83.5%, 99.3%, 94.8%, and 97.1% after the fan filter unit (FFU) was equipped with a chemical filter. AMCs mainly include benzene, toluene, ethylbenzene, xylene (BTEX), alkanes and alkenes, though BTEX accounts for 77% of the total. VOC concentrations in cleanrooms fitted with FFU chemical filters and where the process equipment was not in operation were found to be lower than those at domestic residences and slightly higher than those found in commercial aircraft cabin air. The daily average TVOC concentrations were negatively correlated with temperature (R2 = 0.46, p < 0.01) and positively correlated with humidity (R2 = 0.26, p < 0.01). The daily average NH3 concentrations were negatively correlated with T (R2 = 0.19, p < 0.05) and positively correlated with RH (R2 = 0.18, p < 0.01). Dibutyl phthalate (DBP) and dioctyl phthalate/diethylhexyl phthalate (DOP/DEHP) were detected in the new sealing joint strips in the HEPA filters. Phthalates and organophosphates were not detected in the new filter papers.