Integrated Global Digital Image Correlation for Interface Delamination Characterization

Abstract

Interfacial delamination is a key reliability challenge in composites and micro-electronic systems due to (high-density) integration of dissimilar materials. Predictive finite element models are used to minimize delamination failures during design, but require accurate interface models to capture (irreversible) crack initiation and propagation behavior observed in experiments. Therefore, an Integrated Global Digital Image Correlation (I-GDIC) strategy is developed for accurate determination of mechanical interface behavior from in-situ delamination experiments.Recently, a novel miniature delamination setup was presented that enables in-situ microscopic characterization of interface delamination while sensitively measuring global load–displacement curves for all mode mixities. Nevertheless, extraction of detailed mechanical interface behavior from measured images is challenging, because deformations are tiny and measurement noise large. Therefore, an advanced I-GDIC methodology is developed which correlates the image patterns by only deforming the images using kinematically-admissible ‘eigenmodes’ that correspond to the few parameters controlling the interface tractions in an analytic description of the crack tip deformation field, thereby greatly enhancing accuracy and robustness. This method is validated on virtual delamination experiments, simulated using a recently developed self-adaptive cohesive zone (CZ) finite element framework.KeywordsDigital image correlationInterfacial delaminationInterface behavior identificationIntegrated global DICNumerical validation