Abstract
In this paper we present a silicon black-body emitter array chip fabricated using the standard 3 μm CMOS technology available through the Canadian Microelectronic Corporation and a maskless post-fabrication micromachining process developed at Simon Fraser University. The transducer chip comprises of a 2 × 2 array of silicon black-body emitters (thermal pixels) integrated with on-chip control circuitry. The paper will discuss the transducer design, micromachining-related design constraints on the CMOS layout design, the micromachining technique and the circuit performance.
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