Abstract
AbstractA novel integrated‐circuit‐pressed ceramic‐package antenna is proposed for the first time. The antenna is intended for use in the single‐chip solutions of wireless transceivers using deep submicron complementary metal‐oxide semiconductor (CMOS) technology. The prototype antenna printed on a dual‐in‐line integrated‐circuit‐pressed ceramic package is comparatively studied at 2.4 GHz with and without CMOS chip loading. The results show that CMOS chip loading greatly increases the impedance bandwidth, but slightly decreases the radiation efficiency of the antenna. The loaded antenna achieves an impedance bandwidth of 15.7% and a radiation efficiency of 64 ± 4%, which are sufficient for most applications. © 2004 Wiley Periodicals, Inc. Microwave Opt Technol Lett 42: 143–147, 2004; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.20233
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