Insulating substrates for cubic GaN-based HFETs

Abstract

The growth of cubic group III-nitrides is a direct way to eliminate polarization effects, which inherently limits the fabrication of normally off heterojunction field-effect transistors (HFETs) in the GaN technology. However, for the achievement of electronic devices with cubic nitrides an important precondition is the availability of a high-resistive substrate or GaN buffer layer with zinc-blende crystal structure. We investigated the applicability of carbonized high resistance Si (001)-substrates and thick conductive free-standing 3C-SiC (100) substrates with an Ar+-ion-damaged surface layer for this purpose and studied the use of carbon-doped GaN buffer layers for electrical insulation. We found that Ar-implantation of 3C-SiC is an appropriate alternative to fabricate insulation layer for cubic GaN (c-GaN) growth and that C-doped GaN buffers introduce non-linear I–V characteristics. The structural properties of c-GaN on Ar-implanted 3C-SiC are comparable to GaN on untreated 3C-SiC whereas on carbonized Si substrates an increase of dislocation density and surface roughness is observed.