Abstract
The total reflection fluorescent X-ray analysis will be descrived regarding instrumentation, sample handling, and applications of chemical trace element, surface and depth profiling analysis. When the incident radiation with a small grazing angle is irradiated to smooth sample surface, the radiation is totally reflected which does not react to the constituent elements contained on the surface and near the surface of samples. One can obtain low background X-ray spectrum and high sensitive X-ray spectra. The detecting limit of transition elements on a silicon wafer is the level of ppb and ppt.
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