Abstract
Solder quality is a critical issue in circuit board production. However, the manufacturing process of today has few built‐in controls to ensure good solder quality. Instead, attention is only paid when a defect is found. The solution lies in the integration of inspection, test and process control. Now a new method, Scanned‐Beam Laminography, takes 3‐dimensional X‐ray slices of solder joints, enabling thorough inspection of each joint. Special software algorithms measure and report the solder joint conditions, creating a system which provides real‐time process control.
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