Abstract
The heterogeneous evolution of microstructure in a single grain Cu/SAC305/Cu solder joint is investigated using in-situ thermal cycling combined with electron backscatter diffraction (EBSD). Local deformation due to thermal expansion mismatch results in heterogeneous lattice rotation within the joint, localised towards the corners. This deformation is induced by the constraint and the coefficient of thermal expansion (CTE) mismatch between the β-Sn, Cu6Sn5 and Cu at interfaces. The formation of subgrains with continuous increase in misorientation is revealed during deformation, implying the accumulation of plastic slip at the strain-localised regions and the activation of slip systems (110)[11]/2 and (0)[111]/2.
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