Abstract
Following the observation of the effect of laser deflash (originally intended to remove tape residues) on the integrity of the NiPdAu surface and its impact on solderability, differential scanning calorimetric (DSC) analyses were performed on Sn-coated intact and modified surfaces. Morphological analyses revealed the preservation of topographical features after surface modification. The enthalpy of formation (ΔHf), derived from the deconvolution and peak fitting of the overall thermogram afforded the isolation of individual contribution from simultaneous/competing intermetallic compound (IMC) formations: −1.88kJmol−1 for AuSn4, −1.86±1.44kJmol−1 for PdSn2/PdSn4, −3.26±0.83kJmol−1 for Ni3Sn4, and −3.88±0.85kJmol−1 for (Cu,Ni)6Sn5. The evolution of the individual contributions showed strong dependence on the surface nature prior to solderability testing, with the insights into their behavior discussed in detail.
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