Insights and Applications of Composite Electroplating

Abstract

Composite electroplating is the process of particle incorporation during the electrolytic deposition of metal. This process produces composite films consisting of a metallic matrix containing a dispersion of small particles. The advantages of composite electrodeposition over other coating methods are the uniformity of deposition even for complex shapes, the strong adhesion to the substrate, reduction of waste compared to dipping or spraying techniques, low levels of contamination, the ability to produce functionally-gradient material and to continuously process parts. In addition, this process avoids the problems associated with high temperature or vacuum processing.There are many contradictory experimental results in literature concerning the effects of the electrocodeposition process variables on particle incorporation. The effects of some of the process variables also vary for different particle-electrolyte combinations and cell configurations. Some of the reported contradictions are a direct consequence of incomparable hydrodynamics. The bulk of experimental electrocodeposition research has been conducted using a vertical parallel plate electrode set-up. In this configuration, the particles are maintained in suspension by either stirring the solution, vibrating a perforated plate at the bottom of the cell, bubbling gas, or pumping the suspension through the cell, all of which result in uncontrollable, and hence incomparable hydrodynamics. Other contradictions are due to the fact that the process parameters were evaluated only for a narrow range of experimental parameters and to differences in particle size and purity.This talk discusses the experimental results and mathematical modeling of electrocodeposition of particles in a metallic matrix. The effects of several key parameters, such as current density, particle loading, electrolyte composition, particle surface charge and polarity, on particle incorporation in electrodeposited composite coatings were studied and modeled. All experiments were done utilizing rotating disk electrodes over a wide range of experimental conditions in which the incorporation behavior changes appreciably, yielding reproducible data for better interpretation of process effects and modeling. These studies were combined with colloidal probe AFM experiments and process archeology using pulse plating which helped to understand the codeposition mechanism.