Abstract
As with the commercial market, Military/Aerospace electronic packaging has similar needs to develop smaller/lighter/ higher performance electronics. This need has required the use of High Density Interconnect (HDI) circuit boards and Grid Array components (ball and column) in rugged environment applications such as military and space. This discussion will cover the technology study program conducted by Honeywell Defense and Space Electronics Systems on the mechanical durability of HDI (High Density Interconnect) and Grid Array component packaging and its application into “Hi Rel” aerospace programs.
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