Abstract
This paper describes an innovative system integration scheme wherein heterogeneous materials and devices, including photonic devices as well as electronics, are organically integrated on silicon-core circuitry to achieve better performance, higher functionality and lower cost. First, some general integration technology trends in semiconductor electronics are described. Then, after a discussion of new heterogeneous integration schemes based on silicon-core technologies, recent attempts and applications are shown such as low power LSIs, sensors and micromachine switches on silicon and milimeter-wave photonics.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: International Journal of High Speed Electronics and Systems
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
