Innovative construction of high-strength tungsten-copper joint through laser texture and nano-activation

Abstract

Tungsten-copper (W-Cu) joints hold immense promise as plasma-facing materials in fusion reactors. However, the inherent immiscibility of W-Cu poses significant challenges in joint fabrication. Here, we introduce an innovative methodology that incorporates laser texture, W surface nano-activation, and subsequent diffusion bonding to fabricate W-Cu joints. Remarkably, the joints achieved exhibit unparalleled mechanical properties, with a peak tensile strength of 201 MPa and a shear strength of 141 MPa, surpassing previously reported W-Cu joints. To gain insights into the underlying mechanisms, we conducted a multiscale analysis utilizing scanning electron microscopy (SEM), high-resolution transmission electron microscopy (HRTEM), and density-functional theory (DFT) calculations. Our findings reveal a unique embedded structure and a metallurgically bonded interface at the W-Cu junction. Furthermore, the diffusion zone at the interface exhibits a fascinating hybrid crystal structure, maintaining a body-centered cubic (BCC) structure in certain regions while displaying a tetragonal crystal structure (with lattice parameters a=b=2.8617, c=3.44) in others. This tetragonal crystal structure formation within the W-Cu diffusion zone remains unexplored in previous literature. In summary, this novel W-Cu bonding approach not only offers a cutting-edge solution for modern manufacturing and fusion energy applications but also lays a solid theoretical foundation for understanding the intricate microstructure-property relationships in W-Cu systems.