Innovations and Insights in Fluid Flow and Slime Adhesion for Improved Copper Electrorefining

Abstract

Copper electrorefining is an old technique that is generally performed in electrolytic cells with a bottom inlet and top outlet that are convenient for electrolyte flow control. Nevertheless, this configuration cannot effectively direct electrolyte flow to the regions between electrodes, which results in weak convection and inadequate delivery of chemical species and additives. In this article, we discuss the innovations in electrorefining cell design to improve electrolyte flow for better cathode quality and simulation of fluid flow field and particle movements based on finite element modeling method. The resulting fluid flows in cells can transport suspended slime particles to the cathode, where they can be incorporated as impurities. The concentration of suspended slime particles is inversely related to slime adhesion, which is strongly influenced by slime particle sintering, and sintering is dependent on temperature and slime particle composition. Thus, the combination of innovative fluid flow and slime particle sintering can play important roles in improving cathode quality.