Innovation Ultrasonic Assistant Soldering in Electronics

Abstract

Innovative approaches in ultrasonic assistant soldering consist consists of increasing the activity of cavitation and accelerating diffusion processes at the interface between the solder and the soldering material. Besides that, it improves the effectiveness of cavitation processes in melts by saturating gas cavities with diamete rs that are smaller than the resonant sizes of cavitation germs. Gas saturation of liquids and melts raises level of cavitation pressure by 20 25%25%, that intensifies US processing of cleaning, soldering and metallization. Modelling diffusion process showed that the US activation increased the concentration of diffusing elements of Zn and Al in the interface depth by 15 20% on average, and the combined activation by the US and electric field increased it by 30 45%. Furthermore, as the energy quantity adsorbed by melt increases, increased amplitude and frequency of US vibrations induces concentration rise. The heat energy was also boosted by combining the activation of the melt–soldered material system with US vibrations energy and high current pulses. This allows for a faster increase in soldering temperature, as well as improved solder wettability.