Abstract

The existing methodology for Front Opening Unified Pod (FOUP) cleaning, storage, and transfer is inherently flawed in three areas: a) equipment layout, b) intra-process wait time, and c) human handling. In each area, improved solutions are suggested and a new approach is developed and named In-line FOUP Cleaner (IFC). IFC is a new, singular approach accomplished via total integration of multiple equipment types including sorter, FOUP cleaner, stocker, particle counter, and the FDC monitoring system. Utilizing the IFC approach, significant improvements have been documented with respect to all three areas of concern. Overall cost savings, as well as a side benefit of improved fume removal, are carefully observed. It appears to be an interesting approach to solving the problems associated with FOUP cleaning, storage, and transfer for the next generation semiconductor fab.

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