Inkjet-printed boron-doped poly-Si/SiOx passivating contacts

Abstract

In this study, we explore the utilization of inkjet printing technology with liquid ink to fabricate boron-doped polycrystalline silicon (poly-Si)/SiOx passivating contacts. The impacts of substrate morphology, baseplate temperature, and surface oxide on the printing performance were investigated to achieve distinct printed patterns. Moreover, a pre-oxidation process at 750 °C for 30 min was conducted as a strategy to prevent dopant spreading from the printed pattern via the gas phase during the high-temperature annealing. Thereafter, the influences of annealing temperature on the formed poly-Si passivating contact quality were studied. By applying optimized process conditions on intrinsic poly-Si(i-poly-Si)/SiOx/p-type crystalline Si (c-Si) substrates, promising surface passivation was achieved with an implied open-circuit voltage (iVoc) of 718 mV and a low contact resistivity (ρc) of 6.1 mΩ cm2 after annealing at 950 °C followed by a hydrogenation treatment. Optical images demonstrate that single-droplet dopant lines with a width of 69 μm could be realized on a mechanically polished substrate by printing with a drop spacing of 40 μm, while the line width expands on rough surfaces or when printing with a reduced drop spacing. Furthermore, high-resolution micro-photoluminescence maps clearly illustrate the localization of the boron-doped regions on polished and planar substrates after annealing. We also realized the formation of localized inkjet-printed phosphorus- and boron-doped poly-Si passivating contacts simultaneously within a single annealing step at 950 °C. These findings underscore the potential of inkjet printing as a promising technique for fabricating localized poly-Si/SiOx passivating contacts in high-efficiency silicon solar cells.