Abstract
In this article, the optimization of printing properties on a new, flexible ceramic substrate is reported for sensing and antenna applications encompassing internet of things (IoT) devices. E-Strate® is a commercially available, non-rigid, thin ceramic substrate for implementing in room temperature and high-temperature devices. In this substrate, the printing parameters like drop spacing, number of printed layers, sintering temperature, and sintering time were varied to ensure an electrically conductive and repeatable pattern. The test patterns were printed using silver nanoparticle ink and a Dimatix 2831 inkjet printer. Electrical conductivity, high-temperature tolerance, bending, and adhesion were investigated on the printed samples. The three-factor factorial design analysis showed that the number of printed layers, sintering temperature, sintering time, and their interactions were significant factors affecting electrical conductivity. The optimum printing parameters for the thin E-Strate® substrate were found to be 20 μm drop spacing, three layers of printing, and 300 °C sintering temperature for 30 min. The high-temperature tolerance test indicated a stable pattern without any electrical degradation. Repetitive bending, adhesion test, and ASTM tape tests showed adequate mechanical stability of the pattern. These results will provide insight for investigators interested in fabricating new IoT devices.
Highlights
There is an unmet need for integrated, inexpensive, and conformal devices with a smaller footprint in the era of the internet of things (IoT) [1,2,3]
While the paper and polymer substrates are suitable for room temperature device operation [12], high-temperature operation require ceramic substrates
The optimum printing parameters on thin E-strate® are determined in order to obtain a highly conductive and mechanically stable printed pattern, a critical requirement of flexible devices
Summary
There is an unmet need for integrated, inexpensive, and conformal devices with a smaller footprint in the era of the internet of things (IoT) [1,2,3]. Federal agencies in the U.S [9] and industry are looking for an integrated, high-temperature operable, and flexible wireless sensor system solution [10]. A reliable inkjet printing process is essential for large scale device fabrication In this context, the optimum printing parameters on thin E-strate® are determined in order to obtain a highly conductive and mechanically stable printed pattern, a critical requirement of flexible devices. The optimum printing parameters on thin E-strate® are determined in order to obtain a highly conductive and mechanically stable printed pattern, a critical requirement of flexible devices The printing parameters such as drop spacing, the number of printed layers, sintering temperature, and sintering duration were investigated. To assess flexibility and pattern durability, the authors performed bending and adhesion tests
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