Inkjet Printing of SiO2 Hollow Spheres/Polyimide Hybrid Films for Foldable Low-k ILD

Abstract

We demonstrate inkjet printing as a viable method for flexible interlayer dielectrics (ILDs) films with a low dielectric constant, excellent mechanical characteristics, and thermal properties in foldable organic light emitting diodes (OLEDs). SiO2 hollow spheres (SHSs)/polyimide (PI) hybrid films were printed by SiO2 coated polystyrene (PS) ink and PI ink. The relative permittivity of the hybrid films decreased from 3.45 to 1.87. The thermally stable PI fims maintained their weight below 500 °C from the TGA result. The dielectric constant and current density retained their properties after 50,000 cycles of bending at a 1 mm bend radius. We propose that the inkjet printing of SHSs/PI hybrid films described herein is a promising approach for flexible ILDs in foldable OLEDs.