Abstract

This paper presents the fabrication of an inkjet-printed multilayer bandpass filter using the liquid crystal polymer (LCP) system-on-package (SOP) technology. The LCP-SOP technology adopted by lamination bonding process reduces the occupied area of a device and is suitable for radio frequency (RF) package applications. The surface morphologies and RF performance of the inkjet-printed silver film on an LCP substrate after the lamination bonding process, which entails applying high temperatures and pressures, were observed and analyzed. Acceptable performance of the inkjet-printed silver film of an optimal lamination bonding condition was 0.69 MPa at 270 °C. Using the inkjet-printing and LCP-SOP technologies, a miniature bandpass filter was created with a minimal $S_{21}$ value and a maximal $S_{11}$ value of −1.5 and −17.4 dB at 10.6–14.5-GHz passband, respectively. A strain effect of silver line and bandpass filter was also analyzed. The results demonstrated the effectiveness of the proposed design methodology and the fabrication technique.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.