Abstract
This publication provides an overview of additive manufacturing techniques including Inkjet, 3D and 4D printing methods. The strengths, opportunities and advantages of this array of manufacturing techniques are evaluated at different scales. We discuss first the applicability of additive manufacturing techniques at the device scale including the development of origami inspired tunable RF structures as well as the development of skin-like conformal, flexible systems for wireless/IoT, Smartag and smart city applications. We then discuss application at the package scale with on package printed antennas and functional packaging applications. Following this, there is a discussion of additive manufacturing techniques in applications at the die scale such as 3D printed interconnects. The paper is concluded with an outlook on future advancements at the component scale with the potential for fully printed passive components.
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