Abstract
Abstract This study utilizes experimental and microscopic characterization methods to investigate the prospects and feasibility of using the Injection Over-Molding (IOM) process to replace traditional adhesives in the manufacturing of complex ribbed panel structures with Polyether Ether Ketone (PEEK) composites. The results indicate that the IOM process can achieve the optimal bonding strength of adhesives while significantly reducing the processing cycle, demonstrating substantial potential. Additionally, enhancing the melt temperature and mold temperature can further improve interface bonding quality and increase bonding strength. Based on the experimental results, it is inferred that increasing the melt temperature can elevate the interface temperature while raising the mold temperature can slow down the interface cooling rate, suggesting mechanisms by which these parameters influence interface bonding quality.
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