Injection Current Barrier Formation for RbF Postdeposition‐Treated Cu(In,Ga)Se2‐Based Solar Cells

Abstract

AbstractAmong the thin‐film solar cell technologies, Cu(In,Ga)Se2‐based solar cells demonstrate the highest efficiencies, where the recent boost in efficiency is triggered by a KF postdeposition treatment (PDT). In this contribution, Cu(In,Ga)Se2‐based solar cells are fabricated using RbF PDTs after absorber layer growth with varying substrate and RbF source temperature. The electronic charge transport properties of the solar cell devices are investigated using temperature‐dependent current–voltage analysis and admittance spectroscopy. To investigate the observed transport barriers, a novel concept based on the differential series resistance is proposed. This approach is supported by simulations of current–voltage curves, which reproduce qualitatively experimental data. Experimentally, two parallel conduction paths are found, which act as barriers with different activation energies and impede the charge carrier transport. Both the thickness and height of these barriers increase with an increasing amount of incorporated Rb and can lead to losses in the fill factor and power conversion efficiency at room temperature. Etching in HCl prior to CdS buffer layer deposition reduces the barrier width and can recover these losses.