Abstract
The early stages of plastic flow and microcreep have been studied in single crystals and in polycrystalline copper and aluminum using a method with a strain sensitivity of 2 × 10 −6 in the temperature range −196 to 25°C. The temperature dependence of the 10 −6 yield stress is interpreted as arising from a thermal activation of stacking faults under stress. This model results in a value of 25 ergs/cm 2 for the stacking fault energy of copper and 100 ergs/cm 2 for aluminum.
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