Abstract
In apparel manufacturing, textile bonding with adhesives has become an evolving and a popular construction method. In this research, InfraRed Thermography (IRT) was investigated as a potential Non Destructive Testing (NDT) method for adhesively bonded textile structures. It is found that the spatial homogeneity of the temperature distribution in the bonded area correlates with the Peel Strength (PS) of that bond. A threshold value for the in-homogeneity in the thermal distribution can be set to distinguish between a bad bond and a good bond. IRT results also elucidate on a two-step glue distribution pattern during the thermal treatment that influence the PS of the bond. The use of Fast Fourier Transform (FFT) technique to analyze the thermal images for the spatial extent of temperature distribution within the bonded seam and for possible correlation with the bond strength is also discussed.
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