Abstract
ABSTRACTThe stress distribution in silicon substrates under a silicon dioxide thin film edge, long oxide thin film stripes and long oxide window structures have been studied using the infrared photoelastic (IRPE) method. The experimental IRPE stress fringe patterns were compared with the simulated patterns based on an analytic solution we obtained recently for the stress distribution under a thin film edge in isotropic substrates. Dependence of the stress distribution in these structures on the geometrical parameters such as the stripe width, window width, and substrate thickness were also studied. The implication of a slight discrepancy between the experimental and simulated IRPE patterns on the singular behavior of stress field in the substrate at the film edge and the concentrated force assumption are discussed.
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