Abstract
Nondestructive infrared detection of solder defects in solenoid coil connectors was investigated. A detailed experimental setup and a meticulous and repeatable experimental procedure were developed. The experimental methods were firmly based on the application of heat transfer science. Time averaged excess temperature ([Formula: see text]) was the sole discrimination parameter, and a difference larger than 2°C between good and defective solders was conservatively considered for good discrimination. Analysis of variance determined the minimum differences in [Formula: see text] between good and defective solder joints. The effects in discriminability of heating time ( th), time integration interval length ( ti), region of interest (ROI) geometry, and solder radiative properties were investigated. A rectangular ROI tightly enclosing the good solder was found as the best discrimination ROI. Matte black paint increasing radiative emission of solder joints significantly reduced discriminability. The defects were discriminated from the good solder for a rectangular ROI, th = 78 s, and ti = 20 s. Moreover, an excellent total inspection time of 34 s per solenoid coil is obtained by considering a well-controlled inspection environment during manufacturing, severe defects detection, and a possible 1°C difference for discrimination. Several aspects of the novel inspection procedure developed can greatly benefit the thermal imaging scientific community.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.