Abstract
Texas Instruments continues to push the limits of its hybrid ferroelectric uncooled focal plane array (UFPA) technology to improve performance and producibility. Emphasizing standard silicon wafer processing techniques, TI has developed a state of the art manufacturing facility which routinely produces significant volumes of high quality, low cost infrared detector assemblies. These arrays are being delivered as part of a variety of thermal imaging products to serve both military and commercial applications. Future improvements in device performance and cost will open the door to a new realm of imaging applications.
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