Abstract
Solid-state lightings (SSL) rapidly penetrate the global illumination market because of the energy efficiency and the reliability. The energy efficiency can be easily evaluated but the reliability is not convenient to be estimated. Among several reliability issues, a LED chip level's reliability could be a difficult problem because chip failures related to electromigration phenomenon are hard to be detected in the early stages. In order to remove potential leakage LEDs in modules, additional screening method is necessary to be performed occasionally. In this study, chip package interaction (CPI) for LED packages was investigated in order to estimate stresses of the LED chip in the module level. This methodology would help LED manufacturers to perform a robust design of LED packages in terms of the LED chip reliability. The electromigration is related to metal diffusion, which belongs to a creep phenomenon. As the creep strain is a function of temperature, stress and time, quantifying stresses in the metal layers of the LED die can be useful information for LED manufacturers to make an engineering decision in the early stages of manufacturing.
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