Abstract
In this study, the validated computer model was further applied to evaluate effects of aluminum (AL) plate thicknesses, electrical/dielectric properties, surface areas, or air gaps on RF heating behaviors in a rectangular polypropylene (PP) container. Simulated results showed that volumetric temperature uniformity index (TUI) and electric field intensity (EFI) of whole samples increased with increasing thickness of an AL plate. The lowest TUI (0.042) of the second layer was obtained when the plate area was changed to 190 × 130 mm2. A composite plate (210 × 150 × 2 mm3) composed of central part with AL plate and other part with PP plate was proposed to replace the single AL plate based on simulation results. The experimental TUI (0.063 ± 0.001) on second layer surface of watermelon seeds with inserting one composite and three AL plates was significantly lowest (P < 0.05) among those of samples with inserting four AL or composite plates.
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