Influences of high-temperature annealing on atomic layer deposited Al2O3/4H-SiC

Abstract

High-temperature annealing of the atomic layer deposition (ALD) of Al2O3 films on 4H-SiC in O2 atmosphere is studied with temperature ranging from 800 °C to 1000 °C. It is observed that the surface morphology of Al2O3 films annealed at 800 °C and 900 °C is pretty good, while the surface of the sample annealed at 1000 °C becomes bumpy. Grazing incidence X-ray diffraction (GIXRD) measurements demonstrate that the as-grown films are amorphous and begin to crystallize at 900 °C. Furthermore, C—V measurements exhibit improved interface characterization after annealing, especially for samples annealed at 900 °C and 1000 °C. It is indicated that high-temperature annealing in O2 atmosphere can improve the interface of Al2O3/SiC and annealing at 900 °C would be an optimum condition for surface morphology, dielectric quality, and interface states.